淺談Mini&Micro LED顯示屏功耗
來源:艾比森 編輯:ZZZ 2024-04-03 10:56:36 加入收藏 咨詢

所在單位: | * |
姓名: | * |
手機: | * |
職位: | |
郵箱: | * |
其他聯系方式: | |
咨詢內容: | |
驗證碼: |
|
淺談Mini/Micro LED顯示屏功耗
撰稿人:產品規劃(hua)經理DevinQin
近(jin)年來,LED顯(xian)示(shi)屏小點間距往(wang)微間距、面(mian)板化趨勢發展(zhan),Mini/Micro LED的(de)(de)出(chu)現讓(rang)LED顯(xian)示(shi)屏進入to C領域成為可能。與此同時,隨著(zhu)國家雙碳政策(ce)的(de)(de)實施(shi),LED顯(xian)示(shi)屏作為用電大(da)戶正受到越來越多的(de)(de)人關注(zhu)。LED憑(ping)借高(gao)亮度、無縫拼接、長壽(shou)命等(deng)(deng)優點在控制室、展(zhan)覽展(zhan)示(shi)、高(gao)端商(shang)顯(xian)等(deng)(deng)應用場景得(de)到廣(guang)泛使用,但隨著(zhu)LED不斷替(ti)代LCD,客戶對LED產品的(de)(de)功(gong)耗(hao)提(ti)出(chu)更高(gao)要(yao)求,而采用Mini/Micro LED技術(shu)和特有節能方案的(de)(de)產品功(gong)耗(hao)能夠得(de)到大(da)幅降低。那么,影響Mini/Micro LED功(gong)耗(hao)的(de)(de)核(he)心因素到底是什么?讓(rang)我們(men)一探究竟。
1、倒(dao)裝(zhuang)Mini/Micro LED技(ji)術 眾所周知,倒(dao)裝(zhuang)LED相較(jiao)于正裝(zhuang)LED結構更簡(jian)單、尺寸更小、發(fa)(fa)光(guang)效率更高(gao)、散(san)熱更好。倒(dao)裝(zhuang)LED表面(mian)無金(jin)屬(shu)線連接與遮擋,五面(mian)發(fa)(fa)光(guang),發(fa)(fa)光(guang)效率高(gao),在相同亮度下,倒(dao)裝(zhuang)LED所費能耗更低。




倒(dao)裝(zhuang)(zhuang)LED除了節省能耗外,其小(xiao)尺寸芯(xin)片也能帶來高對比度、高穩(wen)定(ding)(ding)性。倒(dao)裝(zhuang)(zhuang)芯(xin)片只有6個焊(han)點(dian),正裝(zhuang)(zhuang)芯(xin)片有10個焊(han)點(dian),焊(han)點(dian)減少40%,且正裝(zhuang)(zhuang)芯(xin)片焊(han)點(dian)間距近(jin),金(jin)屬遷移風險高,易造(zao)成芯(xin)片失效,穩(wen)定(ding)(ding)性遠不如倒(dao)裝(zhuang)(zhuang)LED。
2、表(biao)面封(feng)裝(zhuang)膠(jiao)層(ceng)(ceng) Mini/Micro LED的(de)應用(yong)讓小(xiao)間距逐步進入(ru)面板(ban)化時代,Mini/Micro LED表(biao)面均采用(yong)封(feng)膠(jiao)層(ceng)(ceng)保護(hu)處(chu)理(li),表(biao)面封(feng)膠(jiao)層(ceng)(ceng)材料選擇對(dui)(dui)(dui)功耗(hao)(hao)至關重(zhong)要。理(li)論上,表(biao)面封(feng)膠(jiao)層(ceng)(ceng)透過率(lv)越(yue)高(gao),LED芯片(pian)發光損耗(hao)(hao)就(jiu)越(yue)小(xiao),同(tong)等條件下(xia)功耗(hao)(hao)也會更低(di)。但(dan)高(gao)透過率(lv)與高(gao)對(dui)(dui)(dui)比(bi)度存在(zai)矛盾,表(biao)面做得(de)更黑的(de)同(tong)時也會降低(di)透過率(lv),從(cong)而影響功耗(hao)(hao)。所以(yi)在(zai)透過率(lv)和(he)對(dui)(dui)(dui)比(bi)度之(zhi)間找到(dao)平衡(heng)點至關重(zhong)要,有方案通(tong)過底填技(ji)術確保PCB墨色(se)一致(zhi)性及(ji)高(gao)對(dui)(dui)(dui)比(bi)度,表(biao)面再(zai)用(yong)透明膠(jiao)層(ceng)(ceng)保護(hu)處(chu)理(li),可在(zai)不(bu)降低(di)對(dui)(dui)(dui)比(bi)度的(de)同(tong)時實現低(di)功耗(hao)(hao),但(dan)墨色(se)一致(zhi)性較難把控。Mini/Micro LED采用(yong)高(gao)分子材料墨色(se)涂(tu)層(ceng)(ceng)及(ji)復合封(feng)裝(zhuang)膠(jiao)體,在(zai)保證墨色(se)一致(zhi)性和(he)高(gao)對(dui)(dui)(dui)比(bi)度的(de)同(tong)時,實現更低(di)功耗(hao)(hao)。


3、 共(gong)陰驅動(dong)(dong)方案(an)(an) 共(gong)陽驅動(dong)(dong)是指(zhi)單(dan)(dan)顆(ke)(ke)LED像素正(zheng)極連接,負極驅動(dong)(dong);而共(gong)陰驅動(dong)(dong)恰恰相反,LED像素負極連接,正(zheng)極驅動(dong)(dong)。單(dan)(dan)顆(ke)(ke)像素由R、G、B三顆(ke)(ke)LED芯片(pian)組成,但三顆(ke)(ke)LED芯片(pian)供電電壓(ya)(ya)(ya)不一(yi)致,藍色和(he)綠(lv)色燈珠一(yi)般采(cai)(cai)用3.8V電壓(ya)(ya)(ya),紅燈工作(zuo)電壓(ya)(ya)(ya)更(geng)低(di)(di)僅為(wei)(wei)2.8V。為(wei)(wei)了確(que)保(bao)供電電壓(ya)(ya)(ya)一(yi)致,傳統(tong)方案(an)(an)在(zai)紅燈驅動(dong)(dong)側加(jia)外接電阻改變(bian)電壓(ya)(ya)(ya),而多(duo)余的功耗主(zhu)要(yao)以熱的形式散發出(chu)去(qu)。而共(gong)陰驅動(dong)(dong)則(ze)采(cai)(cai)用紅、綠(lv)、藍三種芯片(pian),實際需(xu)要(yao)的電壓(ya)(ya)(ya)進(jin)行分(fen)開精準供電,可(ke)有(you)效(xiao)降(jiang)(jiang)能(neng)耗,同時屏體熱量也有(you)所降(jiang)(jiang)低(di)(di)。據(ju)相關(guan)數據(ju)統(tong)計,采(cai)(cai)用共(gong)陰方案(an)(an)的LED顯(xian)示屏較常規(gui)產品(pin)同等條件(jian)下能(neng)耗降(jiang)(jiang)低(di)(di)10%~20%。共(gong)陰方案(an)(an)的驅動(dong)(dong)IC、電源均和(he)常規(gui)產品(pin)不一(yi)樣,可(ke)選型相對較少,需(xu)要(yao)行業上下游(you)協同普及,同時共(gong)陰專利問(wen)題也值得(de)關(guan)注(zhu)。




4、 節(jie)能(neng)驅(qu)(qu)(qu)動(dong)IC LED顯(xian)示屏驅(qu)(qu)(qu)動(dong)IC是的(de)重要組成部分,驅(qu)(qu)(qu)動(dong)IC的(de)性能(neng)高低不(bu)僅決定了LED顯(xian)示屏顯(xian)示效果,而且對顯(xian)示屏功(gong)耗影響較大(da)。隨著點(dian)(dian)間距(ju)的(de)微縮化,驅(qu)(qu)(qu)動(dong)IC呈倍數增(zeng)加,點(dian)(dian)間距(ju)在1mm以下的(de)驅(qu)(qu)(qu)動(dong)IC功(gong)耗占比(bi)大(da)大(da)增(zeng)加,驅(qu)(qu)(qu)動(dong)IC的(de)選型對能(neng)耗較低至(zhi)關重要。


a.低轉折電壓驅動技術可保證驅動IC的輸出電流在更低的拐點電壓下穩定驅動LED燈珠(zhu)(zhu),從(cong)而降(jiang)低(di)整(zheng)個系統供電(dian)電(dian)壓,降(jiang)低(di)LED燈(deng)珠(zhu)(zhu)及(ji)驅動IC的功耗;
b.IC動態節(jie)能(neng)技(ji)術可有(you)效降(jiang)低顯(xian)示功耗。當(dang)顯(xian)示畫面(mian)(mian)出(chu)現(xian)(xian)黑畫面(mian)(mian)時,傳統驅(qu)動IC輸(shu)出(chu)通道仍處于(yu)打開(kai)狀(zhuang)態會(hui)產生多余的能(neng)耗,擁有(you)動態節(jie)能(neng)技(ji)術的IC可根據不(bu)同的顯(xian)示畫面(mian)(mian),動態調(diao)節(jie)輸(shu)出(chu)功耗進而(er)實現(xian)(xian)降(jiang)耗降(jiang)低的目的。
c.進入Mini /MicroLED微間距顯示(shi)時代,需要(yao)更高集成驅動(dong)方案,采用(yong)行列合一多通道及高制程驅動(dong)IC 可大幅度降(jiang)低功耗。
5、高(gao)轉(zhuan)換(huan)效率(lv)(lv)電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan) LED電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan)作為顯示(shi)屏(ping)的(de)重要組成部分(fen),能夠將交流(liu)220/110V電(dian)(dian)(dian)(dian)壓轉(zhuan)換(huan)為LED芯(xin)片可接(jie)受(shou)的(de)2.8~5 V直流(liu)電(dian)(dian)(dian)(dian)壓。電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan)的(de)好壞很大程度上影響LED顯示(shi)屏(ping)的(de)功(gong)(gong)耗,采用高(gao)轉(zhuan)換(huan)效率(lv)(lv)和帶FPC功(gong)(gong)能的(de)電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan)可直接(jie)減(jian)少顯示(shi)屏(ping)功(gong)(gong)耗。電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan)采用LLC電(dian)(dian)(dian)(dian)路(lu)、雙(shuang)管正激式高(gao)效率(lv)(lv)電(dian)(dian)(dian)(dian)路(lu),同時減(jian)小DC端輸出(chu)電(dian)(dian)(dian)(dian)源(yuan)(yuan)(yuan),如對紅(hong)、綠、藍三色(se)芯(xin)片分(fen)壓供電(dian)(dian)(dian)(dian)來達到更好的(de)節能效果。

a.電(dian)(dian)源(yuan)(yuan)轉換(huan)效(xiao)率(lv):電(dian)(dian)源(yuan)(yuan)轉換(huan)效(xiao)率(lv)就(jiu)是電(dian)(dian)源(yuan)(yuan)對于(yu)電(dian)(dian)能的利用(yong)效(xiao)率(lv)。對于(yu)一源(yuan)(yuan)來說,電(dian)(dian)源(yuan)(yuan)的轉換(huan)效(xiao)率(lv)越高,產生的廢(fei)熱就(jiu)越少(shao)。除(chu)了電(dian)(dian)源(yuan)(yuan)本身的轉換(huan)率(lv)外,產品對電(dian)(dian)源(yuan)(yuan)的利用(yong)率(lv)也會直接影響電(dian)(dian)源(yuan)(yuan)的轉換(huan)率(lv),合理的負載能夠有(you)效(xiao)減少(shao)電(dian)(dian)源(yuan)(yuan)做無用(yong)工。
b.電(dian)源(yuan)PFC功(gong)(gong)能:即(ji)功(gong)(gong)率(lv)因(yin)數校正(zheng),是一種提高用電(dian)設(she)備功(gong)(gong)率(lv)因(yin)數以提高電(dian)力利用率(lv)的技(ji)術(shu)。功(gong)(gong)率(lv)因(yin)素常(chang)用cosΦ表(biao)示,最(zui)高值(zhi)為1,最(zui)低為0。通常(chang)功(gong)(gong)率(lv)因(yin)數可(ke)以衡量(liang)電(dian)力被有(you)效利用的程度,當功(gong)(gong)率(lv)因(yin)數值(zhi)越大,代(dai)表(biao)其電(dian)力利用率(lv)越高。
6、黑(hei)(hei)屏(ping)待機(ji)功(gong)能(neng) 除產品硬件設計外,還(huan)需考量產品實際場景(jing)使用。會議室(shi)、展覽展示(shi)、高(gao)端商顯等場景(jing)存在屏(ping)體黑(hei)(hei)屏(ping)但卻(que)未斷電的(de)(de)情形,這要求LED顯示(shi)屏(ping)具備(bei)待機(ji)低(di)功(gong)耗(hao)功(gong)能(neng)。常規產品待機(ji)顯示(shi)畫(hua)面(mian)雖然(ran)黑(hei)(hei)屏(ping),但LED模組(zu)仍(reng)在工作,屏(ping)體表(biao)面(mian)仍(reng)在發熱。新一代(dai)的(de)(de)黑(hei)(hei)屏(ping)待機(ji)節(jie)電功(gong)能(neng)在屏(ping)體不(bu)用時(shi),可自(zi)動切(qie)斷模組(zu)或者單元箱(xiang)體的(de)(de)供電,進(jin)而(er)降低(di)LED能(neng)耗(hao)成本。

影響LED顯(xian)示(shi)(shi)(shi)(shi)屏的(de)功耗(hao)(hao)因素很(hen)多,可(ke)以(yi)(yi)確定的(de)是(shi)采(cai)用倒裝Mini/Micro LED技(ji)術的(de)LED顯(xian)示(shi)(shi)(shi)(shi)屏能(neng)耗(hao)(hao)較傳統產(chan)(chan)品(pin)同等條(tiao)件下能(neng)耗(hao)(hao)降(jiang)低(di)40%以(yi)(yi)上,同時更低(di)的(de)功耗(hao)(hao)意味(wei)著更低(di)的(de)熱(re)量和更好(hao)的(de)使用體(ti)驗。我國LED產(chan)(chan)值占全球第一,LED顯(xian)示(shi)(shi)(shi)(shi)屏隨處可(ke)見,如何節(jie)能(neng)、減排一直是(shi)屏企非(fei)常重視的(de)問題,節(jie)能(neng)、低(di)功耗(hao)(hao)也是(shi)未來LED顯(xian)示(shi)(shi)(shi)(shi)技(ji)術發(fa)展的(de)重要方向。2023年5月國家更新(xin)了《顯(xian)示(shi)(shi)(shi)(shi)器能(neng)效(xiao)(xiao)(xiao)限定值及能(neng)效(xiao)(xiao)(xiao)等級(ji)》,里面加入了對(dui)LED一體(ti)機的(de)能(neng)效(xiao)(xiao)(xiao)等級(ji)判定,這(zhe)是(shi)LED顯(xian)示(shi)(shi)(shi)(shi)首(shou)次被納入能(neng)效(xiao)(xiao)(xiao)標準(zhun)范圍。隨著該(gai)標準(zhun)的(de)實施,LED顯(xian)示(shi)(shi)(shi)(shi)產(chan)(chan)品(pin)準(zhun)入門檻將會(hui)提高,將會(hui)淘汰掉眾多高能(neng)耗(hao)(hao)產(chan)(chan)品(pin),激發(fa)企業(ye)對(dui)產(chan)(chan)品(pin)節(jie)能(neng)的(de)關注。
評論comment